LAON TMD Co., Ltd.

Other equipment

Vacuum Oven System

SOURCE350℃
Wafer size6”, 8”
ChamberCassette 2 Lots
TempRamp Up/Down control

Plasma Electrostatic Exclusion System

ApplicationLCD
Size6.5G
Vacuum Pressure760 Torr ~ 10-8 Torr
ChamberFor Static Electricity removal
Equipment size2,500 x 1,600 x 1,060
LogisticsL/L, PM

OLED Etch PM

ApplicationLCD, OLED
Alignment TypeCCD Vision Aligner
Vacuum Pressure760 Torr ~ 10-5 Torr
ProcessGLASS ETCH
Equipment size2,300(W) x 1,500(D) x 2,000 (H)
Plasma applicationCold Plasma, Thermal Plasma

OLED Evaporator PM

ChamberSTS304
EVA. SourcePoint cell, Linear source
Vacuum PressureLow Vacuum
Size5.5G
ESCThickness Controller, Substrate Heater, Substrate Rotation

FPD Logistics
(L/L Chamber, TM Chamber)

ApplicationLCD, OLED
Alignment TypeCCD Vision Aligner
Vacuum Pressure760 Torr ~ 10-5 Torr
ProcessGLASS ETCH
Vacuum LogisticsTM, LL, UL
Equipment size2,300(W) x 1,500(D) x 2,000 (H)

OLED
(Half 6G Load Lock, Half 6G TM)

Vacuum Equipment
(Pre-Clean, Sputter, CVD Equipment Development, LL/UL, TM, Utility & System Design for Research)

ApplicationOLED, Semiconductor
TypeSingle, Batch Type
Vacuum Pressure760 Torr ~ 10-7 Torr
Vacuum LogisticsTM, LL, UL, Inverter etc.
Etc.Customer Requirement Spec.

OLED Depo. Equipment
(OLED Evaporator Chamber, L/L Chamber, TM Chamber)

ChamberSquare & Vertical Shape
EVA. SourceCustomer Spec.
Vacuum PressureHigh ~ Low Vacuum (Full Range)
Vacuum LogisticsTM, LL, UL
ESCThickness Controller, Substrate Heater, Substrate Rotation
LET’S MEET EACH OTHER

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Call or visit us : 09:00 ~ 18:00 (except Sat, Sun and public holidays)

TEL: 82-31-8077-2500 laontmd@laontmd.com 150-ho, 425, Doksanseong-ro, Osan-si, Gyeonggi-do, Republic of Korea, 18105